High Heat Flux Two-Phase Cooling of Electronics with Integrated Diamond/Porous Copper Heat Sinks and Microfluidic Coolant Supply

초록

We here present an approach to cooling of electronics requiring dissipation of extreme heat fluxes exceeding 1 kW/cm(2) over similar to 1 cm(2) areas. The approach applies a combination of heat spreading using laser micromachined diamond heat sinks; evaporation/boiling in fine featured (5 mu m) conformal porous copper coatings; microfluidic liquid routing for uniform coolant supply over the surface of the heat sink; and phase separation to control distribution of liquid and vapor phases. We characterize the performance of these technologies independently and integrated into functional devices. We report two-phase heat transfer performance of diamond/porous copper heat sinks with microfluidic manifolding at full device scales (0.7 cm(2)) with heat fluxes exceeding 1300 W/cm(2) using water working fluid. We further show application of hydrophobic phase separation membranes for phase management with heat dissipation exceeding 450 W/cm(2) at the scale of a single extended surface (similar to 300 mu m).

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