Low‐Loss Silicon‐on‐Quartz (SoQ)‐Based Aperture‐Coupled Antenna on RF MEMS Packaging Platform

초록

This letter presents a micromachined aperture-coupled antenna which improves antenna performances as well as simplifies a fabrication process. The SoQ (silicon-on-quartz) bonding and BCB (benzocyclobutene) adhesive bonding are employed for a radio frequency microelectro-mechanical system (RF-MEMS) packaging platform. The SoQ/BCB packaging platform makes the air cavity and tire quartz substrate where the aperture-coupled antenna is stacked. Therefore, radiation performance:: can be enhanced from low-loss air/quartz substrates while a silicon substrate has almost no effects on radiation. Furthermore, the proposed method enables simultaneous integration of the antenna with the RF MEMS devices through a single packaging process. In this letter, are antenna is manufactured based on the proposed method and the fabrication process is carefully described. The s-parameters and shear strength are measured to evaluate both of antenna and packaging performances. (C) 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 52: 125-128, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24874

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