Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition

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초록

In this work, the degradation of poly(ethylene glycol-propylene glycol) copolymer (PEG-PPG) and its effect on the electrodeposition of Cu were investigated. PEG-PPG became fragmented during the electrodeposition with changing its terminal groups from hydroxyl to aldehyde, formic ester, and ketone. The aged solution showed a higher saturation current density than the fresh solution in chronoamperometry (CA) measurements, resulting from an easier desorption of the cleaved PEG-PPG from the copper surface through the competition with bis-(3-sulfopropyl)-disulfide (SPS). Furthermore, the electrical resistivity of Cu films deposited from the aged solution increased due to a decrease in the grain sizes. (C) 2014 Published by Elsevier B.V.

키워드

Copper electrodeposition; Additive; Poly(ethylene glycol-propylene glycol); Decomposition; Cyclic voltammetry stripping; SUPERCONFORMAL CU ELECTRODEPOSITION; ADVANCED INTERCONNECT METALLIZATION; POLYETHYLENE-GLYCOL; THERMAL-DEGRADATION; TRIBLOCK COPOLYMER; ORGANIC ADDITIVES; BIS(3-SULFOPROPYL) DISULFIDE; MOLECULAR-WEIGHT; CHLORIDE-IONS; ACCELERATOR
제목
Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition
저자
Choe, Seunghoe; Kim, Myung Jun; Kim, Hoe Chul; Lim, Taeho; Park, Kyung Ju; Kim, Kwang Hwan; Ahn, Sang Hyun; Lee, Anna; Kim, Soo-Kil; Kim, Jae Jeong
DOI
10.1016/j.jelechem.2013.12.023
발행일
2014-02
유형
Article
저널명
Journal of Electroanalytical Chemistry
권
714
페이지
85 ~ 91