웨어러블 디바이스를 위한 다중 센서/통신용 모듈형 플랫폼 기술

초록

In this paper, a modular platform for wearable devices is proposed which can be easily assembled by exchanging functions according to various field and environment conditions. The proposed modular platform consists of a 32-bit RISC CPU, a 32-bit symmetric multi-core processor, and a 16-bit DSP. It also includes a plug & play features which can quickly respond to various environments. The sensing and communication modules are connected in the form of a chain. This work is implemented in a standard 130 nm CMOS technology and the proposed modular wearable platforms are verified with temperature and humidity sensors.

키워드