Comparison of Pumped vs. Capillary-driven TwoPhase Microcoolers for High Heat Flux Applications

초록

In this study, a comparative performance analysis is conducted between conventional two-phase forced convection cooling (pumped) and capillary-based cooling. Both types of microcoolers employ silicon micropin fin structures with dimensions of 5×5mm2 (diameter: 11μ m, spacing: 20μ m, height: 100μ m) integrated into two types of three-dimensional manifold. For the pumped twophase flow microcooler, a 3D-printed manifold is utilized, achieving a heat flux of approximately 950 W/cm2, a superheat of ∼20∘C (base Tsat ∼112∘C), a flow rate of 77 g/min, and a vapor exit quality of xe∼0.06. In contrast, the capillary-based two-phase microcooler employs a “capillary-based” copper wire mesh 3D manifold, achieving a heat flux of ∼500 W/cm2 with a superheat of ∼7∘C (base Tsat ∼100∘C) resulting in a heat transfer coefficient of 500,000 W/m2−∘C with a flow rate of 3 g/min, and xe∼1. It is noteworthy that the flow rate required for the capillarybased cooling system is only one-tenth of that needed for the conventional two-phase cooling system. Additionally, this study reports the thermal instability and pressure drops for both cooling methods.

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