V-Band Planar Helical Antenna using TGSV Technology

초록

This paper presents a design of V-hand planar helical antenna using tungsten-coated through glass-silicon via (TGSV) structure technology. Proposed antenna is designed on Borosilicate glass substrate having much lower dielectric loss than silicon at high frequencies. Proposed antenna has very low profile of 1.6 lambda(0) at center frequency with substrate thickness of 0.07 lambda(0). A 3.5-turn helical antenna with 7 tungsten-coated silicon vias and total 6 connecting arms is designed with microstrip feed line having a 10-dB impedance bandwidth of 50.7 to 63.4 GHz. Proposed antenna is on-chip design and serves as best candidate to be well integrated with installations, either as square or rectangular structures. Proposed applications are mm-wave radar imaging and tracking.

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