QFP 패키지의 새로운 고주파 등가 회로 모델

New High-Frequency Equivalent Circuit Model for QFP Package

초록

We present a new high-frequency equivalent circuit model for 52pin QFP used in typical IC's and extract R, L, and C values of this circuit model using a 3-D E & M field simulator. Futhermore, L and C value variations as a function of pin number due to the shape differences of the leads have been fitted to 2nd order polynomials in order to extend the applicability of this model.

키워드

QFP; Bonding Wire; Lead Frame; S-parameters; Radio Frequency
제목
QFP 패키지의 새로운 고주파 등가 회로 모델
제목 (타언어)
New High-Frequency Equivalent Circuit Model for QFP Package
저자
김성종; 송상헌
발행일
2005-07
저널명
전기학회논문지 C권
권
54
호
7(C)
페이지
339 ~ 342