Development of a Hybrid Single/Two-phase Capillary-based Micro-cooler using Copper Inverse Opals Wick with Silicon 3D Manifold for High-Heat-Flux Cooling Application

초록

Previously, we reported two-phase capillary-based cooling using narrow (200 to 1000 μm) heater bridge copper inverse opal (CIO) wicks with heat flux level of 1400 Wcm-2 and superheat ≈ 10 . Here, we demonstrate the area scaling of the proposed technology to a large-area micro-cooler for high-heat-flux cooling of microprocessors and power electronics. We developed a hybrid single/two-phase micro-cooler that relies on capillary-wicking in a 25-μm-thick CIO with an open silicon microchannel 3D-manifold for liquid delivery and vapor extraction, achieving a high heat flux ≈ 400 Wcm-2 over a heated area of 10 × 10 mm2. For a range of inlet water flowrates from 5 to 60 g(min)-1, we achieved total thermal resistances and vapor qualities of 0.68 cm2W-1 to 0.2 cm2W-1 and 0.55 to 0.12, respectively. The flowrates are 10× smaller than those of conventional single- or two-phase microchannel cooling technology. The corresponding two-phase thermal resistances ranges from 0.05 to 0.02 cm2W-1 with temperature superheat of 8 to 6 , respectively. While the overall performance of the large-area (10 × 10 mm2) capillary-based micro-cooler degraded compared to the previous demonstration of the technology for a heated area of 5 × 5 mm2, however, preliminary CFD modeling indicates that an improved manifold design will be able to achieve comparable performance. © 2024 IEEE.

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