Silver direct electrodeposition on Ru thin films

  • Koo, Hyo-Chol; 
  • Cho, Sung Ki; 
  • Lee, Chang Hwa; 
  • Kim, Soo-Kil; 
  • Kwon, Oh Joong; 
  • 외 1명
Citations

WEB OF SCIENCE

6
Citations

SCOPUS

8

초록

Electrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed initial population of Ag particles, and as a result a smooth film was obtained. (C) 2008 The Electrochemical Society.

키워드

DIRECT COPPER ELECTRODEPOSITION; CHEMICAL-VAPOR-DEPOSITION; ATOMIC LAYER DEPOSITION; DIFFUSION BARRIER; CU METALLIZATION; RUTHENIUM; NUCLEATION; GROWTH; TIN; ADHESION
제목
Silver direct electrodeposition on Ru thin films
저자
Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong
DOI
10.1149/1.2890394
발행일
2008-05
유형
Article
저널명
Journal of the Electrochemical Society
권
155
호
5
페이지
D389 ~ D394