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Fracture behavior of glass bead filled epoxies: Cleaning process of glass beads
- Lee, Jonghwi;
- Yee, Albert F.
WEB OF SCIENCE
32초록
Inorganic particles are commonly cleaned with solvents such as alcohols before being incorporated into thermoset polymers as fillers or tougheners, but the role of the cleaning process has never been examined. In this study, the effect of the cleaning process on the fracture behavior of particulate composites is investigated using glass bead filled epoxies as model systems. The cleaning process is shown to be a simple method to strengthen the interface between the glass beads and the epoxy matrix. Although the chemistry of the glass bead surface is unlikely to be altered by the cleaning process, submicron particles that exist on the glass bead surfaces are removed by cleaning with distilled water or ultrasonic vibration. The removal of submicron particles increases the interfacial strength between the glass beads and the matrix and changer, the tensile strength of the composites. However, the modulus and fracture toughness of the composites is not significantly dependent on the cleaning process. Thus, it may be the case that debonding of the glass beads is not one of the major energy dissipating mechanisms in the fracture of glass bead filled thermoset systems. (C) 2000 John Wiley & Sons, Inc.
키워드
- 제목
- Fracture behavior of glass bead filled epoxies: Cleaning process of glass beads
- 저자
- Lee, Jonghwi; Yee, Albert F.
- 발행일
- 2001-02
- 유형
- Article
- 권
- 79
- 호
- 8
- 페이지
- 1371 ~ 1383
- 언어
- ENG
- 출판사
- WILEY
- 발행국가
- 미국
- 분량
- 13 페이지
- ISSN
- E 1097-4628
P 0021-8995