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Communication-Monitoring the Average Molecular Weight of Polyethylene Glycol in an Acidic Cu Plating Bath
- Choe, Seunghoe;
- Kim, Myung Jun;
- Lim, Taeho;
- Ham, Yu Seok;
- Kim, Soo-Kil;
- 외 1명
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5초록
We devise a novel electrochemical method that enables the analysis of the average molecular weight (MW) of polyethylene glycol (PEG) in an acidic Cu plating bath. During the cyclic voltammetry analysis of the Cu plating bath, a hysteretic voltammogram is generated, and it is related to the MW of PEG. This relationship is used for the analysis of the average MW of PEG in the acidic Cu plating solution, with the error of analysis being less than 9%. (C) 2016 The Electrochemical Society. All rights reserved.
키워드
COPPER ELECTRODEPOSITION; PERFORMANCE; SUPPRESSORS; ADDITIVES
- 제목
- Communication-Monitoring the Average Molecular Weight of Polyethylene Glycol in an Acidic Cu Plating Bath
- 저자
- Choe, Seunghoe; Kim, Myung Jun; Lim, Taeho; Ham, Yu Seok; Kim, Soo-Kil; Kim, Jae Jeong
- 발행일
- 2016
- 유형
- Article
- 권
- 163
- 호
- 14
- 페이지
- D747 ~ D749
- 언어
- ENG
- 출판사
- ELECTROCHEMICAL SOC INC
- 발행국가
- 미국
- ISSN
- E 1945-7111
P 0013-4651