ScholarWorks@중앙대학교

초록

Stretchable electronics rely on fabrication techniques that enhance both the manufacturing efficiency and mechanical stability. In this study, we proposed a high-field-assisted deep-printing approach that embeds silver nanowire (AgNW) networks within a polydimethylsiloxane (PDMS) matrix in a single step. Unlike conventional surface-based deposition techniques, this method creates a mechanically robust interface by integrating the conductive network into the bulk polymer, effectively mitigating delamination and enhancing durability. Electromechanical characterization indicated stable conductivity under both monotonic stretching (up to 30 % strain) and cyclic loading (1000 cycles), with the deep-printed AgNW–PDMS composites exhibiting significantly lower resistance variations compared to surface-printed counterparts. Complementary simulations further demonstrated that the conductive percolation pathways were preserved despite angular reorientation during stretching, providing intrinsic redundancy within the network. These results demonstrate that the high-field deep-printing process offers a promising fabrication platform for mechanically resilient interconnects in next-generation wearable sensing systems and soft robotics.

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