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Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application
- Lee, Hyun-Shik;
- An, Shinmo;
- Kim, Young;
- Kim, Do-Kyoon;
- Kang, Jin-Ku;
- ... Choi, Young-Wan;
- 외 3명
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27SCOPUS
31초록
We report on the fabrication of a polymer-based 2.5 Gbps x 4 channel optical interconnecting micro-module for optical printed circuit board (O-PCB) application. An optical waveguide array is used for optical transmission from vertical surface emitting laser (VCSEL) array to photodiode (PD) array and the built-in 45 degrees waveguide mirrors are used for vertical coupling. The optical waveguide array and the 45 degrees mirrors are fabricated by UV imprint process in one-step. We fabricate microlensed VCSELs by micro-inkjetting method, which reduced radiation angle of VCSEL from 18 degrees to 15 degrees for better light coupling. We use solder ball array and pin array for alignment between O-PCB and the electrical sub-boards with alignment mismatch below 10 mu m in x, y and z axis. The fabricated optical interconnection module transmits data at the rate of 2.5 Gbps per channel. (c) 2006 Elsevier B.V. All rights reserved.
키워드
- 제목
- Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application
- 저자
- Lee, Hyun-Shik; An, Shinmo; Kim, Young; Kim, Do-Kyoon; Kang, Jin-Ku; Choi, Young-Wan; Lee, Seung Gol; O, Beom Hoan; Lee, El-Hang
- 발행일
- 2006-04
- 유형
- Article; Proceedings Paper
- 권
- 83
- 호
- 4-9
- 페이지
- 1347 ~ 1351
- 언어
- ENG
- 출판사
- ELSEVIER SCIENCE BV
- 발행국가
- 네덜란드
- 분량
- 5 페이지
- ISSN
- E 1873-5568
P 0167-9317