Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application

  • Lee, Hyun-Shik; 
  • An, Shinmo; 
  • Kim, Young; 
  • Kim, Do-Kyoon; 
  • Kang, Jin-Ku; 
  • ... Choi, Young-Wan; 
  • 외 3명
Citations

WEB OF SCIENCE

27
Citations

SCOPUS

31

초록

We report on the fabrication of a polymer-based 2.5 Gbps x 4 channel optical interconnecting micro-module for optical printed circuit board (O-PCB) application. An optical waveguide array is used for optical transmission from vertical surface emitting laser (VCSEL) array to photodiode (PD) array and the built-in 45 degrees waveguide mirrors are used for vertical coupling. The optical waveguide array and the 45 degrees mirrors are fabricated by UV imprint process in one-step. We fabricate microlensed VCSELs by micro-inkjetting method, which reduced radiation angle of VCSEL from 18 degrees to 15 degrees for better light coupling. We use solder ball array and pin array for alignment between O-PCB and the electrical sub-boards with alignment mismatch below 10 mu m in x, y and z axis. The fabricated optical interconnection module transmits data at the rate of 2.5 Gbps per channel. (c) 2006 Elsevier B.V. All rights reserved.

키워드

optical interconnection; photonic integrated circuit; micro-fabrication; UV embossing
제목
Fabrication of a 2.5 Gbps x 4 channel optical micro-module for O-PCB application
저자
Lee, Hyun-Shik; An, Shinmo; Kim, Young; Kim, Do-Kyoon; Kang, Jin-Ku; Choi, Young-Wan; Lee, Seung Gol; O, Beom Hoan; Lee, El-Hang
DOI
10.1016/j.mee.2006.01.118
발행일
2006-04
유형
Article; Proceedings Paper
저널명
Microelectronic Engineering
권
83
호
4-9
페이지
1347 ~ 1351