Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection II. Enhancement of Cu Superfilling and Leveling

초록

Superfilling and the leveling of Cu electrodeposition have relevance to the adsorption of organic additives and the changes in their surface coverage. In Part I of this study, it is observed that pulse-reverse electrodeposition changes the surface coverage of PEG-Cl-and SPS, by the anodic step. This implies that the performances of superfilling, as well as leveling, can be affected by pulse-reverse electrodeposition. In this research, the influences of pulse-reverse electrodeposition on both superfilling and leveling are investigated, with various conditions of anodic step. It is confirmed that pulse-reverse electrodeposition can improve superfilling, as well as leveling performance, compared to conventional constant potential deposition. The results are explained based on the electrochemical analyses introduced in Part I of this study. (C) 2013 The Electrochemical Society. All rights reserved.

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