ELECTROHYDRODYNAMIC CONDUCTION PUMPING DRIVEN FLOW AND HEAT TRANSFER IN A FLEXIBLE MINICHANNEL

Citations

SCOPUS

0

초록

Numerical investigation of electrohydrodynamic (EHD) conduction pumping driven fluid flow and heat transfer in a flexible minichannel has been performed. The two-way coupled set of governing equations for fluid flow, heat transfer, electric potential, and charge transport are programmed into the existing finite-volume framework of OpenFOAM. A two-species charge transport model which considers the field-enhanced dissociation due to Onsager-Wien effect has been adopted. The ability of EHD conduction pumping mechanism to induce flow in straight and curved configurations of a minichannel are demonstrated. The flow and heat transfer characteristics are quantified in terms of mean velocity, maximum velocity, maximum wall temperaturen and mean Nusselt number. Even at low applied voltages (≤ 1 kV), EHD conduction pumping is able to induce flow and heat transfer in the minichannel, in both the configurations. At 1kV applied voltage, the fall in heat transfer in 90 ° bent configuration is only 4%, as compared to that in the straight minichannel. Results of this study reveal that EHD conduction based pumping is a viable option in flexible minichannel heat sinks. Copyright © 2022 by ASME.

키워드

Cooling; EHD pumping; Flexible electronics; Minichannel; Onsager-Wien effect
제목
ELECTROHYDRODYNAMIC CONDUCTION PUMPING DRIVEN FLOW AND HEAT TRANSFER IN A FLEXIBLE MINICHANNEL
저자
Selvakumar, R.D.; Lee, H.
DOI
10.1115/IMECE2022-89251
발행일
2022
유형
Conference Paper
저널명
ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
권
8