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ELECTROHYDRODYNAMIC CONDUCTION PUMPING DRIVEN FLOW AND HEAT TRANSFER IN A FLEXIBLE MINICHANNEL
- Selvakumar, R.D.;
- Lee, H.
SCOPUS
0초록
Numerical investigation of electrohydrodynamic (EHD) conduction pumping driven fluid flow and heat transfer in a flexible minichannel has been performed. The two-way coupled set of governing equations for fluid flow, heat transfer, electric potential, and charge transport are programmed into the existing finite-volume framework of OpenFOAM. A two-species charge transport model which considers the field-enhanced dissociation due to Onsager-Wien effect has been adopted. The ability of EHD conduction pumping mechanism to induce flow in straight and curved configurations of a minichannel are demonstrated. The flow and heat transfer characteristics are quantified in terms of mean velocity, maximum velocity, maximum wall temperaturen and mean Nusselt number. Even at low applied voltages (≤ 1 kV), EHD conduction pumping is able to induce flow and heat transfer in the minichannel, in both the configurations. At 1kV applied voltage, the fall in heat transfer in 90 ° bent configuration is only 4%, as compared to that in the straight minichannel. Results of this study reveal that EHD conduction based pumping is a viable option in flexible minichannel heat sinks. Copyright © 2022 by ASME.
키워드
- 제목
- ELECTROHYDRODYNAMIC CONDUCTION PUMPING DRIVEN FLOW AND HEAT TRANSFER IN A FLEXIBLE MINICHANNEL
- 저자
- Selvakumar, R.D.; Lee, H.
- 발행일
- 2022
- 유형
- Conference Paper
- 저널명
- ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
- 권
- 8
- 언어
- ENG
- 출판사
- American Society of Mechanical Engineers (ASME)
- ISSN
- P 0000-0000