Screen-printed Via Integrated with 4D-printed Multimaterial for Microwave Circuit Applications

초록

3D printing technology is being actively explored in RF electronics, with 4D printing offering significant potential for creating reconfigurable RF circuits through shape deformation. In these RF circuits, smart materials are used to modulate RF characteristics based on shape changes, enabling applications such as tunable antennas, filters, and metasurfaces. While the via process, a critical component for improving RF circuit performance, has been limited in 3D-printed substrates, this study investigates the RF characteristics of circuits with vias, fabricated on 4D-printed substrates using screen printing. Experimental results demonstrate that via characteristics are stable even after repeated shape deformations, suggesting that 4D printing provides a practical and reliable solution for fabricating RF electronics.

키워드