Solution processing for colloidal nanoparticle thin film: From fundamentals to applications
  • Jeong, Wooseok
  • Lee, Hyeonseok
  • Hwang, Yun Jae
  • An, Boeun
  • Lee, Yeongbin
  • ... Ha, Don-Hyung
  • 외 4명
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초록

Colloidal nanoparticles (NPs) are widely used as building blocks to construct thin film devices owing to their numerous advantages and unique size-dependent properties. The performance of NP-based devices is highly dependent on the film fabrication method and structure. Therefore, understanding the various solution-based thin film fabrication methods is critical for maximizing the device performance by controlling the NP film structures. This review article surveys eleven representative solution processes (dip coating, blade coating, slot-die coating, Mayer rod coating, inkjet printing, roll-to-roll printing, brush coating, drop casting, spin coating, spray coating, and electrophoretic deposition) using colloidal NPs as building blocks. The merits/limitations and basic deposition mechanisms of these processes are discussed in this review for a broad audience to facilitate their customization to individual industrial or laboratory conditions. This review article also aims to provide insights into how solution processing affects the NP thin film device properties by introducing recent achievements and providing the readers with in-depth information that can aid future research. Copyright © 2025. Published by Elsevier B.V.

키워드

Colloidal nanoparticlesFilm fabricationsNanoparticle depositionsSolution processesThin film devicesROLL-TO-ROLLPEROVSKITE SOLAR-CELLSCOFFEE-RING FORMATIONFUSED SILVER NANOWIRESREDUCED GRAPHENE OXIDEELECTROPHORETIC DEPOSITIONORGANIC SEMICONDUCTORFACILE FABRICATIONRAPID FABRICATIONSTRUCTURAL COLOR
제목
Solution processing for colloidal nanoparticle thin film: From fundamentals to applications
저자
Jeong, WooseokLee, HyeonseokHwang, Yun JaeAn, BoeunLee, YeongbinJeong, HeesooKim, GyuhyeonPark, YoonsuKim, MinyoungHa, Don-Hyung
DOI
10.1016/j.cis.2025.103538
발행일
2025-08
유형
Article
저널명
Advances in Colloid and Interface Science
342