ScholarWorks@중앙대학교

초록

Thermal interface materials enabling both efficient heat dissipation and transient thermal buffering are vital for high-power electronics. Although phase-change materials provide reliable temperature regulation, their utility is often restricted by low thermal conductivity and leakage during phase transitions. This work presents a three-dimensionally interconnected silicon nitride scaffold fabricated by whisking albumen and sucrose into a stable foam template incorporated with ceramic particles. Amorphous silicon dioxide and boron trioxide additives were utilized to ensure structural integrity during sintering. Subsequently, azelaic acid was integrated into an epoxy network to suppress leakage while preserving high latent heat capacity. The resulting composite achieved a thermal conductivity of 3.06 W/mK and a latent heat of 88.7 J/g, demonstrating exceptional shape stability up to 250 °C. Quantitative CPU evaluations confirmed that the material reduced steady-state operating temperatures by 7.5 °C. Furthermore, pulse heating tests verified that the composite maintains consistent temperature reduction performance without degradation even under repeated load and idle cycles. By utilizing a cost-effective protein-templating platform for complex ceramic networks, this research establishes a viable pathway for high-performance phase-change material-based thermal interface materials.

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