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IRAL - International Review of Applied Linguistics in Language Teaching
ISSN
P 0019-042X
출판사
J. Groos
국가
GERMANY
발행 상태
활성
데이터베이스 수록 정보
JCR 1997-1999, 2014-2019 (9년)
Scopus 2017-2020 (4년)
SJR 1999-2002, 2006-2019 (18년)
SSCI 2014-2021 (8년)
전체 27건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Facile one-pot fabrication of quasi-spherical copper oxide electrode for supercapacitor
- Bobade, Rushikesh G. ;
- Pande, Shilpa ;
- Padalkar, Navnath S. ;
- Park, Jong Pil ;
- Sarawade, Pradip B. ;
- 외 4명
- 2026-04
- Journal of Materials Science: Materials in Electronics
- Springer
Article
Green bio-assisted synthesis of zinc oxide nanostructure by night jasmine leaf extract for supercapacitor electrode
- Bobade, Rushikesh G. ;
- Pande, Shilpa ;
- Padalkar, Navnath S. ;
- Park, Jong Pil ;
- Shaikh, Shoyebmohamad F. ;
- 외 4명
- 2026-04
- Journal of Materials Science: Materials in Electronics
- Springer
Article
Improving the thermo-mechanical reliability of solderable isotropic conductive adhesive joints by using low- and high-melting-point solder fillers
- Baek, Yi Hyeon ;
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2026
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2025
Article
Effect of Sn-58Bi (SB) and Sn-3Ag-0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Baek, Yi Hyeon ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-12
- Journal of Materials Science: Materials in Electronics
- SPRINGER
Article
Investigation of the thermo-mechanical reliability and microstructural evolution of Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder
- Jung, Myeong Jin ;
- Lee, Jeong Il ;
- Baek, Yi Hyeon ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2025-10
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2024
Article
Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers
- Ha, Yi Hyeon ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2024-11
- Journal of Materials Science: Materials in Electronics
- SPRINGER
2023
Article
Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers
- Ha, Min Jeong ;
- Lee, Jeong Il ;
- Kim, Jong-Min ;
- Yim, Byung-Seung
- 2023-09
- Journal of Materials Science: Materials in Electronics
- Springer
Article
Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler
- Ha, M.J. ;
- Lee, J.I. ;
- Kim, J.-M. ;
- Yim, B.-S.
- 2023-04
- Journal of Materials Science: Materials in Electronics
- Springer
Article
An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)
- Youn, H.J. ;
- Lee, J.I. ;
- Ha, M.J. ;
- Kim, J.-M. ;
- Yim, B.-S.
- 2023-04
- Journal of Materials Science: Materials in Electronics
- Springer
2022
Article
Influence of Cu powders on the wettability and mechanical properties of solderable epoxy composites
- Youn, H.J. ;
- Lee, J.I. ;
- Kim, J.-M. ;
- Yim, B.-S.
- 2022-05
- Journal of Materials Science: Materials in Electronics
- Springer
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