An investigation on wetting characteristics of solder particle for solderable electrically conductive adhesives (ECAs)

Kim, J. M.; Yang, K. C.; Lee, S. B.; Lee, S. H.; Shin, Y. E.; Chang, K. H.; Han, J. G.; Eom, Y. S.; Moon, J. T.; Baek, J. W.; Nam, J. D.

doi:10.4028/www.scientific.net/MSF.580-582.217

상세 보기

An investigation on wetting characteristics of solder particle for solderable electrically conductive adhesives (ECAs)

Kim, J. M.;
Yang, K. C.;
Lee, S. B.;
Lee, S. H.;
Shin, Y. E.;
... Chang, K. H.;
... Han, J. G.;
외 4명

Citations

WEB OF SCIENCE

3

Citations

SCOPUS

3

초록

A novel electrically conductive adhesives (ECAs) with solder particle have been developed. The kinetics of the curing reaction were investigated using isothermal differential scanning calorimeter (DSC). The dynamic DSC scans were also conducted to investigate the temperature dependant curing degree. The temperature dependant viscosity characteristic of polymer was investigated using rheometer. The wetting characteristic of two solders oil two kinds of metals were investigated using all optical microscope. It was found that developed resin material showed good fluxing capacity against Sn-Bi solder on Ni/Au and the wetting angles was about 24 degrees.

키워드

fluxing capacity; low-melting-point alloy; Sn-In; Sn-Bi; viscosity; wettability; FUSIBLE FILLER

제목: An investigation on wetting characteristics of solder particle for solderable electrically conductive adhesives (ECAs)

저자: Kim, J. M.; Yang, K. C.; Lee, S. B.; Lee, S. H.; Shin, Y. E.; Chang, K. H.; Han, J. G.; Eom, Y. S.; Moon, J. T.; Baek, J. W.; Nam, J. D.

DOI: 10.4028/www.scientific.net/MSF.580-582.217

발행일: 2008-06

유형: Proceedings Paper

저널명: Materials Science Forum

권: 580-582

페이지: 217 ~ +