Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers

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초록

A new class of isotropic conductive adhesive (ICA) using a carbon nanotubes (CNTs) and a low-melting-point alloy (LMPA) fillers has been developed. We investigated the fundamental materials characteristics including curing behavior and temperature-dependant viscous property of ICA. In addition, the morphology of conduction paths in each ICA was investigated using X-ray inspection systems and an optical microscope. Mechanical and electrical characteristics of formulated ICAs were determined and compared with those of three kinds of conventional ICAs filled with Ag flakes. The CNT-filled solderable ICA formed good metallurgical interconnection between upper and corresponding lower electrode. In addition, the results indicated that the CNT-filled ICA exhibit lower electrical resistance and higher mechanical strength, as compared with those of conventional ICAs. [doi:10.2320/matertrans.M2010301]

키워드

carbon nanotuubes (CNTs); isotropically conductive adhesive (ICA); low-melting-poing alloy; polymeric composites; PACKAGING APPLICATIONS; SOLDER
제목
Characteristics of Isotropically Conductive Adhesive (ICA) Filled with Carbon Nanotubes (CNTs) and Low-Melting-Point Alloy Fillers
저자
Yim, Byung-Seung; Kim, Jong-Min
DOI
10.2320/matertrans.M2010301
발행일
2010-12
유형
Article
저널명
Materials Transactions
권
51
호
12
페이지
2329 ~ 2331