Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding

초록

In recent years Anisotropic Conductive Films (ACFs) have been widely used in microelectronic packaging applications due to their potential advantages which include low processing temperatures high resolution capabilities and compatibility for nonsolderable materials In this study we investigated a novel thermosonic ACF flip chip bonding process using ultrasonic vibration The thermosonic ACF flip chip bonding was characterized in terms of adhesion strength and electrical property in comparison with conventional thermo compression ACF bonding ACF has a nickel particle with a 4 gm diameter and its recommended thermo compression bonding conditions were 453 K for bonding temperature and 10 s for bonding time The investigated thermosonic flip chip bonding conditions were 433 K and 453 K for bonding temperature and 0 5s and 1 s for bonding time at each temperature respectively In addition a cross section of the ACF Joint was observed using scanning electron microscopy As a result the developed thermosonic flip chip bonding process showed good electrical and mechanical characteristics as compared with those of the conventional thermo compression bonding process In the future we expect that a thermosonic flip chip bonding method with ACFs can be effectively applied to reduce the bonding temperature and time [doi 10 2320/matertrans MJ201016].

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