Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers

  • Yim, Byung-Seung; 
  • Oh, Seung Hoon; 
  • Jeong, Jin Sik; 
  • Kim, Jong-Min
Citations

WEB OF SCIENCE

10
Citations

SCOPUS

10

초록

A novel hybrid composite with low-melting-point alloy fillers was fabricated and characterized through differential scanning calorimeter analysis and viscosity test. Based on the chemo-rheological properties of the hybrid composite, the hybrid interconnection process was determined. The effect of the reduction capability of hybrid composite on the rheology-coalescence-wetting phenomenon of low-melting-point alloy fillers into the hybrid composite was investigated. The hybrid composite has a low viscosity and did not show excessive curing around the melting point of the used low-melting-point alloy material. The low-viscosity characteristic of hybrid composite and the loading of reductant accelerated rheology-coalescence-wetting phenomenon of low-melting-point alloy fillers in hybrid composite significantly. X-ray image and cross-section view revealed a stable metallurgical interconnection between upper and corresponding lower electrode in hybrid composite with reduction capability. This stable metallurgical interconnection was reflected in much improved mechanical and electrical properties of the hybrid interconnection.

키워드

Anisotropic conductive adhesive; coalescence; fluxing capability; intermetallics; low-melting-point alloy; self-interconnection; wettability; ISOTROPIC CONDUCTIVE ADHESIVES; PACKAGING APPLICATIONS; MECHANICAL-PROPERTIES; PARTICLES; RESISTIVITY; SOLDER; FILMS
제목
Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers
저자
Yim, Byung-Seung; Oh, Seung Hoon; Jeong, Jin Sik; Kim, Jong-Min
DOI
10.1177/0021998312445913
발행일
2013-04
유형
Article
저널명
Journal of Composite Materials
권
47
호
9
페이지
1141 ~ 1152