김수길 프로필 사진

김수길

Kim, Soo Kil

창의ICT공과대학

융합공학부

Web Of Science Scopus

자료 필터

자료유형

발행연도

2001 ~ 2026
2001 2026

키워드

언어

전체 188건 중 91번부터 100번까지의 결과를 표시합니다.

2014
Article

Fabrication and evaluation of nickel cobalt alloy electrocatalysts for alkaline water splitting

  • 2014-07
  • Applied Surface Science
  • ELSEVIER SCIENCE BV
Article

Selectivities of an all-wet-processed electrode film on ITO, ZnO, SiNx and doped Si for solar cell applications

  • 2014-07
  • Journal of the Korean Physical Society
  • KOREAN PHYSICAL SOC
Article

Development of a membrane electrode assembly for alkaline water electrolysis by direct electrodeposition of nickel on carbon papers

  • 2014-07
  • Applied Catalysis B: Environment and Energy
  • ELSEVIER SCIENCE BV
Article

Electrodeposited NiCn Alloy Catalysts for Glucose Oxidation

  • 2014-07
  • Bulletin of the Korean Chemical Society
  • KOREAN CHEMICAL SOC
Patent

수소 발생 반응용 니켈 촉매 및 그 제조 방법

  • 장종현 ; 
  • 김수길 ; 
  • 안상현 ; 
  • 황승준 ; 
  • 유성종 ; 
  • 외 3명
  • 2014-04-22
Article

Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition

  • Choe, Seunghoe ; 
  • Kim, Myung Jun ; 
  • Kim, Hoe Chul ; 
  • Lim, Taeho ; 
  • Park, Kyung Ju ; 
  • ... Ahn, Sang Hyun ; 
  • ... Kim, Soo-Kil ; 
  • 외 3명
  • 2014-02
  • Journal of Electroanalytical Chemistry
  • ELSEVIER SCIENCE SA
Article

Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films

  • Kim, Hoe Chul ; 
  • Kim, Myung Jun ; 
  • Lim, Taeho ; 
  • Park, Kyung Ju ; 
  • Kim, Kwang Hwan ; 
  • ... Kim, Soo-Kil ; 
  • 외 2명
  • 2014-01
  • Thin Solid Films
  • ELSEVIER SCIENCE SA
Article

Electrodeposition of Cu Films with Low Resistivity and Improved Hardness Using Additive Derivatization

  • Kim, Hoe Chul ; 
  • Kim, Myung Jun ; 
  • Choe, Seunghoe ; 
  • Lim, Taeho ; 
  • Park, Kyung Ju ; 
  • ... Ahn, Sang Hyun ; 
  • ... Kim, Soo-Kil ; 
  • 외 2명
  • 2014
  • Journal of the Electrochemical Society
  • ELECTROCHEMICAL SOC INC
2013
Article

Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling

  • 2013-12
  • Journal of the Electrochemical Society
  • ELECTROCHEMICAL SOC INC
Article

Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling

  • Kim, Myung Jun ; 
  • Lim, Taeho ; 
  • Park, Kyung Ju ; 
  • Kim, Soo-Kil ; 
  • Kim, Jae Jeong
  • 2013-12
  • Journal of the Electrochemical Society
  • ELECTROCHEMICAL SOC INC