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자료 필터
자료유형
발행연도
2001 ~ 2026
2001 2026
키워드
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전체 188건 중 181번부터 188번까지의 결과를 표시합니다.
2004
Article
Superfilling evolution in Cu electrodeposition - Dependence on the aging time of the accelerator
- Kim, Soo-Kil ;
- Kim, JJ
- 2004-09
- Electrochemical and Solid-State Letters
- ELECTROCHEMICAL SOC INC
Article
Direct plating of low resistivity bright Cu film onto TiN barrier layer via Pd activation
- Kim, JJ ;
- Kim, Soo-Kil ;
- Kim, YS
- 2004-01
- Journal of the Electrochemical Society
- ELECTROCHEMICAL SOC INC
2003
Article
A novel method for Cu electrodeposition on indium tin oxide aided by two-step Sn-Pd activation
- Kim, JJ ;
- Kim, Soo-Kil ;
- Kim, YS
- 2003-09
- Japanese Journal of Applied Physics
- JAPAN SOC APPLIED PHYSICS
Article
Oxidation resistive Cu films by room temperature surface passivation with thin Ag layer
- Kim, JJ ;
- Kim, YS ;
- Kim, Soo-Kil
- 2003-02
- Electrochemical and Solid-State Letters
- ELECTROCHEMICAL SOC INC
Article
Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection
- Kim, JJ ;
- Kim, Soo-Kil ;
- Lee, CH ;
- Kim, YS
- 2003-01
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
- A V S AMER INST PHYSICS
Article
Catalytic behavior of 3-mercapto-1-propane sulfonic acid on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization
- Kim, JJ ;
- Kim, Soo-Kil ;
- Kim, YS
- 2003-01
- JOURNAL OF ELECTROANALYTICAL CHEMISTRY
- ELSEVIER SCIENCE SA
2002
Article
Investigation of copper deposition in the presence of benzotriazole
- Kim, JJ ;
- Kim, Soo-Kil ;
- Bae, JU
- 2002-08
- Thin Solid Films
- ELSEVIER SCIENCE SA
2001
Article
Optimized surface pretreatments for copper electroplating
- Kim, JJ ;
- Kim, Soo-Kil
- 2001-11
- Applied Surface Science
- ELSEVIER SCIENCE BV