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자료 필터
자료유형
발행연도
2001 ~ 2026
2001 2026
키워드
언어
전체 188건 중 171번부터 180번까지의 결과를 표시합니다.
2007
2006
Article
Cationic Surfactants for the control of overfill bumps in Cu superfilling
- Kim, Soo-Kil ;
- Josell, D. ;
- Moffat, T. P.
- 2006-12
- Journal of the Electrochemical Society
- ELECTROCHEMICAL SOC INC
Article
Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system - Reduction of overfill bump formation during superfilling
- Kim, Soo-Kil ;
- Josell, D. ;
- Moffat, T. P.
- 2006-09
- Journal of the Electrochemical Society
- ELECTROCHEMICAL SOC INC
Article
Leveling of superfilled damascene Cu film using two-step electrodeposition
- Kim, Soo-Kil ;
- Hwang, S ;
- Cho, SK ;
- Kim, JJ
- 2006-02
- Electrochemical and Solid-State Letters
- ELECTROCHEMICAL SOC INC
Article
Curvature enhanced adsorbate coverage model for electrodeposition
- Moffat, TP ;
- Wheeler, D ;
- Kim, Soo-Kil ;
- Josell, D
- 2006-02
- Journal of the Electrochemical Society
- ELECTROCHEMICAL SOC INC
2005
Article
A novel process to control the surface roughness and resistivity of electroplated Cu using thiourea
- Kang, MS ;
- Kim, Soo-Kil ;
- Kim, JJ
- 2005-11
- Japanese Journal of Applied Physics
- JAPAN SOC APPLIED PHYSICS
Article
Superconformal Cu electrodeposition using DPS a substitutive accelerator for bis(3-sulfopropyl) disulfide
- Cho, SK ;
- Kim, Soo-Kil ;
- Kim, JJ
- 2005-05
- Journal of the Electrochemical Society
- ELECTROCHEMICAL SOC INC
Article
Superconformal Cu electrodeposition on various substrates
- Kim, Soo-Kil ;
- Cho, SK ;
- Kim, JJ ;
- Lee, YS
- 2005-01
- Electrochemical and Solid-State Letters
- ELECTROCHEMICAL SOC INC
2004
Article
Damascene Cu electrodeposition on metal organic chem-ical vapor deposition-grown Ru thin film barrier
- Cho, SK ;
- Kim, Soo-Kil ;
- Han, H ;
- Kim, JJ ;
- Oh, SM
- 2004-11
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
- A V S AMER INST PHYSICS
Article
Additive-free superfilling in damascene Cu Electrodeposition using microcontact printing
- Kim, Soo-Kil ;
- Kim, JJ
- 2004-09
- Electrochemical and Solid-State Letters
- ELECTROCHEMICAL SOC INC