김종민 프로필 사진

김종민

Jong Min, Kim

공과대학

기계공학부

Scopus ORCID

연구분야

  • Microsystem packaging
  • Nanobubble science

자료유형

발행연도

2002 ~ 2026
2002 2026

키워드

언어

전체 155건 중 1번부터 10번까지의 결과를 표시합니다.

2026
Article

Effects of Nitrogen, Oxygen, and Hydrogen Nanobubbles on Human Lung Fibroblast Viability

  • 2026-02
  • Applied Sciences (Switzerland)
  • Multidisciplinary Digital Publishing Institute (MDPI)
Article

Improving the thermo-mechanical reliability of solderable isotropic conductive adhesive joints by using low- and high-melting-point solder fillers

  • Baek, Yi Hyeon
  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2026
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
2025
Article

Effect of Sn-58Bi (SB) and Sn-3Ag-0.5Cu (SAC) mixing ratio on the thermo-mechanical reliability of SB/SAC composite solder

  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Baek, Yi Hyeon
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2025-12
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

Investigation of the thermo-mechanical reliability and microstructural evolution of Sn-58Bi/Sn-3.0Ag-0.5Cu composite solder

  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Baek, Yi Hyeon
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2025-10
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Article

Sn-58Bi 공정 솔더를 포함하는 SAC-SB 혼합 솔더의 기계적 접합 특성

  • 정명진
  • 하이현
  • 박종문
  • 강승현
  • 김종민
  • 외 1명
  • 2025-04
  • 대한용접접합학회지
  • 대한용접접합학회
2024
Article

Investigation of bonding properties of solderable anisotropic polymer composite filled with low- and high-melting-point alloy fillers

  • Ha, Yi Hyeon
  • Lee, Jeong Il
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2024-11
  • Journal of Materials Science: Materials in Electronics
  • SPRINGER
Patent

미세 기포 발생 시스템

  • 홍형기
  • 우상기
  • 안상수
  • 김종민
  • 오승훈
  • 외 2명
  • 2024-05-13
Article

저융점/고융점 혼합 솔더 필러 함유 Solderable 이방성 고분자 복합 재료의 기계적 접합 특성

  • 하민정
  • 정명진
  • 박종문
  • 최성우
  • 김종민
  • 외 1명
  • 2024-04
  • 대한용접접합학회지
  • 대한용접접합학회
Article

Mechanical Properties of Sn58Bi–Cu Composite Solder Filled with Copper Particles

  • Jung, Myeong Jin
  • Lee, Jeong Il
  • Kim, Jong-Min
  • Yim, Byung-Seung
  • 2024
  • Materials Transactions
  • Japan Institute of Metals (JIM)
1