김종민 프로필 사진

김종민

Kim, Jong Min

공과대학

기계공학부

Scopus ORCID

연구분야

  • Microsystem packaging, 
  • Nanobubble science

자료 필터

자료유형

발행연도

2002 ~ 2026
2002 2026

키워드

언어

전체 151건 중 11번부터 20번까지의 결과를 표시합니다.

2023
Patent

MICROBUBBLE GENERATING SYSTEM

  • HONG, Hyungki ; 
  • WOO, Sangki ; 
  • AHN, Sangsoo ; 
  • KIM, Jongmin ; 
  • OH, Seunghoon ; 
  • 외 2명
  • 2023-09-06
Article

Investigation of interconnection properties of solderable isotropic polymer composite filled with low- and high-melting-point solder mixed fillers

  • Ha, Min Jeong ; 
  • Lee, Jeong Il ; 
  • Kim, Jong-Min ; 
  • Yim, Byung-Seung
  • 2023-09
  • Journal of Materials Science: Materials in Electronics
  • Springer
Article

Mechanisms for the formation of conduction paths in a solderable epoxy composite with a mixed low- and high-melting-point solder filler

  • Ha, M.J. ; 
  • Lee, J.I. ; 
  • Kim, J.-M. ; 
  • Yim, B.-S.
  • 2023-04
  • Journal of Materials Science: Materials in Electronics
  • Springer
Article

An investigation of the bonding properties of Cu particle-filled solderable isotropic polymer composites (Cu-SIPCs)

  • Youn, H.J. ; 
  • Lee, J.I. ; 
  • Ha, M.J. ; 
  • Kim, J.-M. ; 
  • Yim, B.-S.
  • 2023-04
  • Journal of Materials Science: Materials in Electronics
  • Springer
Patent

미세버블 생성 장치

  • 2023-01-25
Article

Mechanical Properties of Solderable Polymer Composites with Low- and High-Melting-Point Solder Mixed Filler

  • Ha, M.J. ; 
  • Kim, S. ; 
  • Cho, W.C. ; 
  • Kim, J.-M. ; 
  • Yim, B.-S.
  • 2023-01
  • Materials Transactions
  • Japan Institute of Metals (JIM)
Article

Investigation of the Mechanical Properties of Sn-58Bi/Sn-3Ag-0.5Cu Composite Solder

  • Jung, Myeong Jin ; 
  • Ha, Yi Hyeon ; 
  • Kim, Jong-Min ; 
  • Lee, Jeong Il
  • 2023
  • Materials Transactions
  • Japan Institute of Metals (JIM)
2022
Article

Proliferative effects of nanobubbles on fibroblasts

  • 2022-11
  • Biomedical Engineering Letters (BMEL)
  • SPRINGERNATURE
Article

Influence of temperature on bulk nanobubble generation by ultrasonication

  • 2022-07
  • Colloids and Interface Science Communications
  • Elsevier B.V.