표성규 프로필 사진

표성규

Pyo, Sung Gyu

창의ICT공과대학

융합공학부

Scopus

자료 필터

자료유형

발행연도

2009 ~ 2026
2009 2026

키워드

언어

전체 122건 중 101번부터 110번까지의 결과를 표시합니다.

2014
Article

Characterization and Selective Properties of Electroless Deposited All Wet Contact Electrode

  • 2014-01
  • Journal of the Electrochemical Society
  • ELECTROCHEMICAL SOC INC
Article

Applications of Scanning Probe-Atomic Force Microscopy in Nanobioelectronics

  • 2014-01
  • Journal of Nanoscience and Nanotechnology
  • AMER SCIENTIFIC PUBLISHERS
2013
Article

Enhanced charge storage by optimization of pore structure in nanocomposite between ordered mesoporous carbon and nanosized WO3-x

  • 2013-12
  • Journal of Power Sources
  • ELSEVIER SCIENCE BV
Article

Measurement of adhesion and bonding strength studies in 3D interconnect structures using atomic force microscopy

  • 2013-11
  • Metals and Materials International
  • KOREAN INST METALS MATERIALS
Article

The effect of calcium phosphate cement-silica composite materials on proliferation and differentiation of pre-osteoblast cells

  • 2013-10
  • Materials Letters
  • ELSEVIER SCIENCE BV
Article

Glucose Oxidation on Gold-modified Copper Electrode

  • 2013-09
  • Bulletin of the Korean Chemical Society
  • KOREAN CHEMICAL SOC
Article

Effect of pre-cleaning treatment and contact wetting angle in the interface between P-doped Si surfaces and selective solar cell electrodes

  • Cui, Yinhua ; 
  • Choi, Eunmi ; 
  • Kim, Areum ; 
  • Oh, Leeseul ; 
  • Lee, Seon Jea ; 
  • ... Park, Hansoo ; 
  • ... Pyo, Sung Gyu ; 
  • 외 2명
  • 2013-07
  • Electronic Materials Letters
  • KOREAN INST METALS MATERIALS
Article

Interface characterization and evaluation of the reactive preclean process for the removal of Cu oxide in the Cu nanointerconnect process

  • Kim, Dong Joon ; 
  • Choi, Heesoo ; 
  • Kim, Areum ; 
  • Choi, Eunmi ; 
  • Park, Hyunjin ; 
  • ... Pyo, Sung Gyu ; 
  • 외 3명
  • 2013-07
  • Current Applied Physics
  • ELSEVIER
Article

삼차원집적공정에서 원자현미경을 활용한 Wafer Bonding Strength 측정 방법의 신뢰성에 관한 연구

  • 2013-06
  • 마이크로전자 및 패키징학회지
  • 한국마이크로전자및패키징학회
Article

Reduction Process of Dislocation and Standby Leakage Current for Embedded Flash Memory Using Nano-Scale Integration

  • 2013-06
  • Journal of Nanoscience and Nanotechnology
  • AMER SCIENTIFIC PUBLISHERS