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2002 ~ 2026
2002 2026
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전체 151건 중 141번부터 150번까지의 결과를 표시합니다.
2005
Article
Novel interconnection method using electrically conductive paste with fusible filler
- Kim, JM ;
- Yasuda, K ;
- Fujimoto, K
- 2005-05
- Journal of Electronic Materials
- SPRINGER
Article
Stress influences on the ultrasonic transducers
- Lee, S ;
- Tanaka, T ;
- Inoue, K ;
- Kim, JM ;
- Shin, YE ;
- 외 1명
- 2005-04
- Sensors and Actuators, A: Physical
- ELSEVIER SCIENCE SA
Article
Resin self-alignment processes for self-assembly systems
- Kim, JM ;
- Yasuda, K ;
- Fujimoto, K
- 2005-03
- Journal of Electronic Packaging, Transactions of the ASME
- ASME-AMER SOC MECHANICAL ENG
Article
Protrusion Jaw가 적용된 볼 당김시험을 이용한 솔더 접합부의 강도와 파괴메커니즘 분석에 관한 연구
- 김형일 ;
- 김종민 ;
- 신영의 ;
- 한성원 ;
- 최명기
- 2005
- 대한용접접합학회지
- 대한용접접합학회
2004
Article
Dynamic modeling for resin self-alignment mechanism
- Kim, JM ;
- Shin, YE ;
- Fujimoto, K
- 2004-06
- Microelectronics and Reliability
- PERGAMON-ELSEVIER SCIENCE LTD
Article
The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging
- Kim, KS ;
- Suganuma, K ;
- Kim, JM ;
- Hwang, CW
- 2004-06
- JOM
- MINERALS METALS MATERIALS SOC
2003
Article
Improvement of board level reliability for mu BGA solder joints using underfill
- Kim, JM ;
- Farson, DF ;
- Shin, YE
- 2003-10
- Materials Transactions
- JAPAN INST METALS
Article
Effect of viscosity of liquid resin on resin self-alignment capability
- Kim, J.M. ;
- Shin, Y.E. ;
- Fujimoto, K.
- 2003-09
- Materials Science Forum
- TRANS TECH PUBLICATIONS LTD