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자료유형
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2002 ~ 2026
2002 2026
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전체 151건 중 121번부터 130번까지의 결과를 표시합니다.
2009
Article
플립칩 패키징 언더필 유동특성에 관한 연구
- 송용 ;
- 김종민 ;
- 이선병 ;
- 전성호 ;
- 임병승 ;
- 외 1명
- 2009
- 마이크로전자 및 패키징학회지
- 한국마이크로전자및패키징학회
2008
Article
Electrical and mechanical characterization of an anisotropic conductive adhesive with a low melting point solder
- Eom, Yong-Sung ;
- Jang, Keonsoo ;
- Moon, Jong-Tae ;
- Nam, Jae-Do ;
- Kim, Jong-Min
- 2008-11
- Microelectronic Engineering
- ELSEVIER SCIENCE BV
Article
Numerical Investigation on Self-Organized Interconnection Using Anisotropic Conductive Adhesive with Low Melting Point Alloy Filler
- Lee, Jin Woon ;
- Lee, Seong Hyuk ;
- Kim, Jong-Min ;
- Kim, Jae Hyung ;
- Lee, Jung Hee
- 2008-11
- Materials Transactions
- JAPAN INST METALS
Article
Development of a visual monitoring system for deformation measuring of welded members and its application
- Han, J. G. ;
- Chang, K. H. ;
- Jang, G. C. ;
- Hong, K. K. ;
- Cho, S. D. ;
- ... Kim, J. M. ;
- 외 2명
- 2008-06
- Materials Science Forum
- TRANS TECH PUBLICATIONS LTD
Article
Reliability evaluation of QFP solder joint using Sn-8Zn-3Bi solder paste during the thermal shock test
- Han, S. W. ;
- Chang, K. H. ;
- Han, J. G. ;
- Cho, I. J. ;
- Kim, J. M. ;
- 외 3명
- 2008-06
- Materials Science Forum
- TRANS TECH PUBLICATIONS LTD
Article
An investigation on wetting characteristics of solder particle for solderable electrically conductive adhesives (ECAs)
- Kim, J. M. ;
- Yang, K. C. ;
- Lee, S. B. ;
- Lee, S. H. ;
- Shin, Y. E. ;
- ... Chang, K. H. ;
- ... Han, J. G. ;
- 외 4명
- 2008-06
- Materials Science Forum
- TRANS TECH PUBLICATIONS LTD
Article
Characterization of polymer matrix and low melting point solder for anisotropic conductive film
- Eom, Yong-Sung ;
- Baek, Ji-Won ;
- Moon, Jong-Tae ;
- Nam, Jae-Do ;
- Kim, Jong-Min
- 2008-02
- Microelectronic Engineering
- ELSEVIER SCIENCE BV
2007