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자료 필터
자료유형
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2002 ~ 2026
2002 2026
키워드
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전체 151건 중 111번부터 120번까지의 결과를 표시합니다.
2010
Article
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
- Jo, Jung-Lae ;
- Lee, Jong-Bum ;
- Kim, Jong-Min ;
- Shin, Young-Eui ;
- Jung, Seung-Boo
- 2010-04
- Journal of Adhesion
- TAYLOR & FRANCIS LTD
Article
Effects of novel carboxylic acid-based reductants on the wetting characteristics of anisotropic conductive adhesive with low melting point alloy filler
- Kim, Hyomi ;
- Kim, Jongmin ;
- Kim, Jooheon
- 2010-02
- Microelectronics and Reliability
- PERGAMON-ELSEVIER SCIENCE LTD
2009
Article
Hybrid Interconnection Process Using Solderable ICAs (Isotropic Conductive Adhesives) with Low-Melting-Point Alloy Fillers
- Yim, Byung-Seung ;
- Kim, Jong-Min ;
- Jeon, Sung-Ho ;
- Lee, Seong Hyuk ;
- Kim, Jooheon ;
- ... Han, Jung-Geun ;
- ... Cho, Minhaeng
- 2009-11
- Materials Transactions
- JAPAN INST METALS
Article
Investigation of the Dynamic Reactive Wetting of Sn-Ag-Cu Solder Alloys on Ni(P)/Au Coated Cu Substrates
- Kim, Taeyoung ;
- Lee, Joonho ;
- Kim, Yunkyum ;
- Kim, Jong-Min ;
- Yuan, Zhangfu
- 2009-11
- Materials Transactions
- JAPAN INST METALS
Article
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
- Yim, Byung-Seung ;
- Kim, Jong-Min ;
- Jeon, Sung-Ho ;
- Lee, Seong Hyuk ;
- Kim, Jooheon ;
- ... Han, Jung-Geun ;
- 외 2명
- 2009-07
- Materials Transactions
- JAPAN INST METALS
Article
Numerical Analysis of Coalescence Characteristics of Low Melting Point Alloy Fillers Using a Non-Equilibrium Phase Field Model
- Kim, Jae Hyung ;
- Lee, Jung Hee ;
- Kim, Jong Min ;
- Lee, Seong Hyuk
- 2009-07
- Materials Transactions
- JAPAN INST METALS
Article
Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip on Copper-Coated Glass for Ultra-Fine Pitch Application in Microelectronics
- Jo, Jung-Lae ;
- Lee, Jong-Bum ;
- Lee, Jong-Gun ;
- Jeon, Sung-Ho ;
- Kim, Jong-Min ;
- 외 4명
- 2009-07
- Japanese Journal of Applied Physics
- JAPAN SOCIETY APPLIED PHYSICS
Article
Curing Kinetics and Mechanical Properties for Siloxane Contained ETSO-DDM/BPH Epoxy System
- Kim, Hyo-Mi ;
- Kim, Jong-Min ;
- Han, Jung-Geun ;
- Kim, Joo-Heon
- 2009-07
- Polymer(Korea)
- POLYMER SOC KOREA
Article
Effect of Atmospheric-Pressure Plasma Treatment on the Joint Strength between Au Flip Chip Bumps and Cu-Finished Si Wafer Substrates Bonded Using Ultrasonic Energy
- Jo, Jung-Lae ;
- Koo, Ja-Myeong ;
- Lee, Jong-Bum ;
- Lee, Jong-Gun ;
- Jung, Seung-Boo ;
- ... Kim, Jong-Min ;
- 외 2명
- 2009-03
- Journal of the Korean Physical Society
- KOREAN PHYSICAL SOC
Article
Characteristics of Sn-2.5Ag flip chip solder joints under thermal shock test conditions
- Yang, Kyoung Chun ;
- Lee, Seong Hyuk ;
- Kim, Jong-Min ;
- Choi, Young Ki ;
- Farson, Dave F. ;
- 외 1명
- 2009-02
- Journal of Mechanical Science and Technology
- KOREAN SOC MECHANICAL ENGINEERS