김종민 프로필 사진

김종민

Kim, Jong Min

공과대학

기계공학부

Scopus ORCID

연구분야

  • Microsystem packaging, 
  • Nanobubble science

자료 필터

자료유형

발행연도

2002 ~ 2026
2002 2026

키워드

언어

전체 151건 중 81번부터 90번까지의 결과를 표시합니다.

2013
Article

Self-interconnection characteristics of hybrid composite with low-melting-point alloy fillers

  • Yim, Byung-Seung ; 
  • Oh, Seung Hoon ; 
  • Jeong, Jin Sik ; 
  • Kim, Jong-Min
  • 2013-04
  • Journal of Composite Materials
  • SAGE PUBLICATIONS LTD
2012
Article

Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers

  • 2012-12
  • Materials Transactions
  • JAPAN INST METALS
Patent

멤브레인 모듈

  • 2012-09-06
Article

Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging

  • 2012-06
  • Microelectronics and Reliability
  • PERGAMON-ELSEVIER SCIENCE LTD
Article

Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)

  • 2012-03
  • Materials Transactions
  • JAPAN INST METALS
Article

Thermal and electrical conductivity of Al(OH)(3) covered graphene oxide nanosheet/epoxy composites

  • 2012-02
  • Journal of Materials Science
  • SPRINGER